Intel and SoftBank Prepare to Reshape the AI Memory Market with Z-Angle Memory
Intel has signed a new collaboration agreement with Saimemory, a subsidiary of SoftBank, to develop 'Z-Angle Memory' (ZAM) technology. This new memory solution aims to compete with HBM (High Bandwidth Memory) used in AI data centers, promising significantly higher capacity and efficiency compared to existing solutions.
Game-Changing Partnership in the AI Memory Market
The strategic collaboration agreement signed between technology giant Intel and Saimemory, a subsidiary of investment holding SoftBank, is considered a significant breakthrough point in the memory technology market that forms the foundation of artificial intelligence (AI) infrastructure. The two companies aim to introduce a new competitor to the high-bandwidth memory (HBM) market, which is particularly critical for large language models and advanced machine learning workloads. The developing technology called 'Z-Angle Memory' (ZAM) stands out with its vertical stacking architecture and is being closely monitored by industry analysts.
The Promises of Z-Angle Memory (ZAM) Technology
The new memory solution promises ambitious performance increases compared to existing HBM (High Bandwidth Memory) technologies. According to statements, ZAM has the potential to offer 2 to 3 times more memory capacity in the same physical space compared to traditional solutions. This means data centers can process much larger datasets within the same physical footprint. In addition to capacity increase, significant improvement in memory bandwidth is also expected. One of the most notable promises comes regarding power consumption. ZAM technology is projected to consume approximately half the power compared to current HBM solutions while executing similar workloads. This could significantly reduce energy costs as well as cooling needs and carbon footprint.
Will Impact Market Dynamics and Intel's Position
This collaboration is not just a technical breakthrough. Intel has been focusing on strengthening its competitive position against AMD and NVIDIA in recent years. The company is trying to increase its presence not only in the processor (CPU) market but also in the graphics processing unit (GPU) and specialized AI accelerator chip markets. This agreement with SoftBank represents a strategic move for Intel to strengthen its position in the AI ecosystem by addressing a critical bottleneck: memory technology. If ZAM technology delivers on its promises, it could disrupt the current HBM market dominated by companies like Samsung and SK Hynix, potentially altering competitive balances in the broader AI hardware sector.
Technical Specifications and Development Timeline
While specific technical details remain limited, preliminary information indicates that ZAM utilizes a novel 3D stacking approach that differs from conventional HBM architectures. The technology reportedly enables higher interconnect density between memory layers, contributing to both the bandwidth improvements and power efficiency. Industry observers note that the partnership combines Intel's advanced semiconductor manufacturing expertise with SoftBank's investment capabilities and Saimemory's specialized memory research. The development timeline suggests initial samples could be available for testing by late 2025, with commercial deployment targeted for 2026-2027 timeframe, coinciding with the expected next generation of AI infrastructure requirements.
